Electrodeposited micro copper bumps for packaging module of a micro-thermoelectric cooler
Document Type
Conference Proceeding
Publication Date
12-1-2009
Publication Source (Journal or Book title)
Proceedings of the ASME Summer Bioengineering Conference, SBC2008
First Page
367
Last Page
368
Recommended Citation
Kardak, A., Podlaha-Murphy, E., Murphy, M., & Devireddy, R. (2009). Electrodeposited micro copper bumps for packaging module of a micro-thermoelectric cooler. Proceedings of the ASME Summer Bioengineering Conference, SBC2008 (PART A), 367-368. Retrieved from https://repository.lsu.edu/mechanical_engineering_pubs/825
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