Electrodeposited micro copper bumps for packaging module of a micro-thermoelectric cooler

Authors

Ajay A. Kardak, Louisiana State University
Elizabeth J. Podlaha-Murphy, College of Engineering
Michael C. Murphy, Louisiana State University
Ram V. Devireddy, Louisiana State University

Document Type

Conference Proceeding

Publication Date

12-1-2009

Publication Source (Journal or Book title)

Proceedings of the ASME Summer Bioengineering Conference, SBC2008

First Page

367

Last Page

368

Recommended Citation

Kardak, A., Podlaha-Murphy, E., Murphy, M., & Devireddy, R. (2009). Electrodeposited micro copper bumps for packaging module of a micro-thermoelectric cooler. Proceedings of the ASME Summer Bioengineering Conference, SBC2008 (PART A), 367-368. Retrieved from https://repository.lsu.edu/mechanical_engineering_pubs/825