A high-temperature nanostructured Cu-Ta-Li alloy with complexion-stabilized precipitates

Authors

• B. C. Hornbuckle, U.S. Army Research Laboratory
• J. A. Smeltzer, P.C. Rossin College of Engineering & Applied Science
• S. Sharma, Ira A. Fulton Schools of Engineering
• S. Nagar, Ira A. Fulton Schools of Engineering
• C. J. Marvel, LSU College of Engineering

Document Type

Article

Publication Date

3-28-2025

Abstract

We present a bulk nanocrystalline copper alloy that can operate at near-melting temperatures with minimal coarsening and creep deformation. The thermal stability of the Cu-3Ta-0.5Li atomic % (at %) alloy is attributed to coherent, ordered L12 Cu3Li precipitates surrounded by a tantalum-rich atomic bilayer phase boundary complexion. Adding 0.5 at % lithium to the immiscible Cu-Ta system changes the morphology of the nanoscale precipitates from spherical to cuboidal while simultaneously tailoring the phase boundary. The resultant complexion-stabilized nanoscale precipitates provide excellent thermal stability, strength, and creep resistance. The underlying alloy design principles may guide the development of next-generation copper alloys for high-temperature applications such as heat exchangers.

Publication Source (Journal or Book title)

Science

First Page

1413

Last Page

1417

Recommended Citation

Hornbuckle, B., Smeltzer, J., Sharma, S., Nagar, S., & Marvel, C. (2025). A high-temperature nanostructured Cu-Ta-Li alloy with complexion-stabilized precipitates. Science, 387 (6741), 1413-1417. https://doi.org/10.1126/science.adr0299