Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies
Document Type
Article
Publication Date
6-1-2024
Abstract
Future multichip packages require die-to-die (D2D) interconnects operating at frequencies above 10 GHz; however, the extension of copper interconnects and epoxy dielectrics presents a trade-off between performance and reliability. This article explores insertion losses and adhesion as a function of interface roughness at frequencies up to 18 GHz. We probe epoxy surface chemistry as a function of curing time and use wet etching to modulate surface roughness. The morphology is quantified by atomic force microscopy (AFM) and 2-D fast Fourier transform (2D FFT). Peel test and vector network analysis are used to examine the impacts of both type and level of roughness. The trade-offs between power efficiency and reliability are presented and discussed.
Publication Source (Journal or Book title)
IEEE Transactions on Components, Packaging and Manufacturing Technology
First Page
984
Last Page
992
Recommended Citation
Park, J., Xu, J., Engler, A., Williamson, J., Mathew, V., Park, S., & Flake, J. (2024). Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies. IEEE Transactions on Components, Packaging and Manufacturing Technology, 14 (6), 984-992. https://doi.org/10.1109/TCPMT.2024.3399662
