Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining
Document Type
Article
Publication Date
3-1-2007
Abstract
We report fabrication of microscale Ta mold inserts by micro-electrical- discharge-machining (μEDM). Morphology, chemistry, and structure of the near-surface region of as-μEDMed Ta blanks have been characterized by scanning electron microscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. A TaC surface layer forms on as-μEDMed Ta surfaces. This altered surface layer was removed by electro-chemical-polishing. Further modification of Ta insert surfaces was accomplished by deposition of a conformal Ti-containing hydrogenated carbon coating. We demonstrate successful replication of high-aspect-ratio microscale structures in Al and Cu by compression molding with such surface-engineered Ta mold inserts. © Springer-Verlag 2007.
Publication Source (Journal or Book title)
Microsystem Technologies
First Page
503
Last Page
510
Recommended Citation
Cao, D., Jiang, J., Jiang, J., Meng, W., & Wang, W. (2007). Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining. Microsystem Technologies, 13 (5-6), 503-510. https://doi.org/10.1007/s00542-006-0198-8
