Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures

Document Type

Article

Publication Date

1-1-2008

Abstract

Metal-based microscale heat exchangers have potential advantages over similar Si-based devices. Bonding and assembly are critical for building functional metal-based microfluidic devices from metallic high-aspect-ratio microscale structures (HARMS). In this paper, we report eutectic bonding of Al specimens with Al-Ge thin film intermediate layers. Quantitative evaluation of bond strengths was carried out as a function of various bonding parameters, including bonding temperature, applied pressure, and Al-Ge intermediate layer thickness. With this eutectic bonding strategy, successful assembly of multilayered Al microfluidic structures is demonstrated. © 2007 Springer-Verlag.

Publication Source (Journal or Book title)

Microsystem Technologies

First Page

99

Last Page

107

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