Document Type
Patent
Patent Number
US 9891006B2
Abstract
Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
Application Number
US15/010,162
Assignees
Louisiana State University
Publication Date
2-13-2018
Recommended Citation
Meng, W., & Mei, F. (2018). Metal-Based Microchannel Heat Exchangers Made by Molding Replication and Assembly. Retrieved from https://repository.lsu.edu/engineering_patents/48