Thermal metallorganic chemical vapor deposition of Ti-Si-N films for diffusion barrier applications

Document Type

Conference Proceeding

Publication Date



Structurally disordered refractory ternary films such as titanium silicon nitride (Ti-Si-N) have potential as advanced diffusion barriers in future ULSI metallization schemes. Here we present results on purely thermal metallorganic chemical vapor deposition (CVD) of Ti-Si-N. At temperatures between 300 and 450 °C, tetrakis(diethylamido)titanium (TDEAT), silane, and ammonia react to grow Ti-Si-N films with Si contents of 0-20 at.%. Typical impurity contents are 5-10 at.%H and 0.5 to 1.5 at.% C, with no O or other impurities detected in the bulk of the film. Although the film resistivity increases with increasing Si content, it remains below 1000 μΩ-cm for films with less than 5 at.% Si. These films are promising candidates for advanced diffusion barriers.

Publication Source (Journal or Book title)

Materials Research Society Symposium - Proceedings

First Page


Last Page


This document is currently not available here.