Dimensional and locational integrity in the replication of polymeric microdevices
Document Type
Conference Proceeding
Publication Date
12-1-2007
Abstract
In molding, geometric variation of molded parts is inevitable since the parts have a thermal history, including expansion and shrinkage, during the molding process. Shrinkage induces variation between the designed dimensions and locations of features on molded parts while the parts are cooled. Characterization of the variation is necessary to ensure dimensional and location integrity. Hot embossing and injection molding were performed in order to assess variation. Measurements were made using a Measurescope (MM-22, Nikon Corp., Kawasaki, Japan). The measured locations and dimensions were compared to estimates obtained using a simple model based on the linear thermal expansion coefficients (CTE) of the molded materials. The measured and the estimated shrinkage from hot embossing were incorporated in the fabrication of microtiter plate-based polymer microfluidic platforms. Copyright © 2007 by ASME.
Publication Source (Journal or Book title)
2007 Proceedings of the ASME InterPack Conference, IPACK 2007
First Page
955
Last Page
959
Recommended Citation
You, B., Park, D., Chen, P., Caceres, W., Nikitopoulos, D., Soper, S., & Murphy, M. (2007). Dimensional and locational integrity in the replication of polymeric microdevices. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007, 2, 955-959. https://doi.org/10.1115/IPACK2007-33482