High-temperature instrumented microscale compression molding of Pb

Document Type

Article

Publication Date

5-1-2004

Abstract

Compression molding of Pb plates with LiGA (Lithographie, Galvanoformung, Abformung) fabricated Ni microscale mold inserts was carried out in the temperature range of 100-300 °C. In-situ measurements of compressive molding force, demolding friction force and insert displacement were carried out with a custom-built, high-vacuum, high-temperature, instrumented molding machine. Microscale features generated on Pb plates and insert condition after repeated molding runs were examined. The in-situ force monitoring capability enabled compressive stresses needed for molding and frictional stresses generated by demolding to be measured as a function of temperature. Our results demonstrate that, in cases where no significant metal/insert chemical interactions exist, present LiGA fabricated Ni inserts possess adequate mechanical properties for repeated micromolding of low melting temperature metals.

Publication Source (Journal or Book title)

Microsystem Technologies

First Page

323

Last Page

328

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