Direct microscale imprinting of Al at room temperature with Si inserts

Document Type

Article

Publication Date

6-1-2008

Abstract

For direct imprinting of metals, hard materials such as diamond and SiC have been used to construct mold inserts in preference to Si, despite the ease in fabricating Si-based micro-/nano- scale structures. In this communication, we demonstrate that micron scale Al structures can be replicated with good fidelity at room temperature by compression molding with Si inserts without incurring insert damage. We further report on results of a finite element analysis of the mechanics of the molding process. The finite element results provide some understanding of the observed lack of damage to the Si inserts. © 2008 Springer-Verlag.

Publication Source (Journal or Book title)

Microsystem Technologies

First Page

815

Last Page

819

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