Microelectronic chip cooling: An experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system

Document Type

Article

Publication Date

3-1-2012

Abstract

Results of heat transfer testing of heat absorption modules (HAM), heat rejection modules (HRM), and arecirculating-liquid cooling system are reported. Lowprofile, Cu-based, microchannel heat exchangers (MHEs) were fabricated and used as the HAM as well as components for assembly of a microchannel HRM. Detailed experimental assessment of two different liquid-passing HRMs and a microchannel-based recirculating-liquid cooling system was carried out, and benchmarked against all-solid devices of the same geometric dimensions. Incorporating microchannel liquid flow through each fin, the device-level heat transfer performance of the microchannel HRM was improved by up to ∼50%. Detailed testing of a microchannel-based recirculating-liquid ooling system indicate that low-profile Cu MHEs are highly effective in heat flux removal while having a small area/ volume footprint, and that enhancing the HRM performance is critical to boosting the overall performance of such recirculating-liquid cooling systems. © 2011 Springer-Verlag.

Publication Source (Journal or Book title)

Microsystem Technologies

First Page

341

Last Page

352

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