Semester of Graduation



Master of Science in Electrical Engineering (MSEE)


Electrical and Computer Engineering

Document Type



In today’s world, consumer electronics are getting smaller than ever. These reductions in size are preceded by advancements in electronic materials engineering and related fields. The need for materials that have various properties and are suitable for applications also necessitated research on different materials. Growing research in the applications of graphene led the way to the discovery of materials that have similar properties to graphene. In this way, the transition metal di-chalcogenides (TMDCs) came into use for electrical engineering. Techniques are required to put TMDCs into application, however here we are going to explain the vital focus of our research which is to discuss a successful method of depositing a solution of dispersed MoSe2 using the voltage-controlled deposition technique. Here we are focusing mainly to find an inexpensive, simple and efficient method to deposit the TMDCs onto substrates.

Initially powdered MoSe2 is dispersed in n-Methyl Pyrrolidone (NMP), and the dispersed solution is deposited onto different substrates. The different substrates that we used in this project were conducting substrate (Al foil), semi-conducting substrate (Si wafer), and insulating substrates (Glass, SiO2, PMMA). At first, MoSe2 was dispersed in NMP using the tip sonication method. Later, by using the voltage-controlled deposition technique the dispersed solution is deposited onto the aforementioned substrates. The final stage of the process is to analyze the deposition of MoSe2 onto the substrates and etched substrates; we used Scanning Electron Microscopy and Raman Spectroscopy.

Through this research we have examined how MoSe2 is dispersed well in NMP, and deposited onto bare and etched substrates as may be useful for future device building surface.



Committee Chair

Theda Daniels Race