Electroless deposition of metals onto organosilane monolayers

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Deposition of gold and copper onto monolayers of 3-aminopropylsilane and 3-mercaptopropylsilane is described. The depositions described here are performed without the aid of a palladium or tin/palladium catalyst. Strongly adherent metal particles attached to the modified surfaces can be produced by placing the silane surfaces either in aqueous solutions of the metal ion of interest (HAuCl4 or CuSO4), followed by exposure of the metal/silane surface to a solution containing only reducing agent (denoted as sequentially prepared films), or aqueous solutions of a reducing agent mixed with the metal ions (denoted as autocatalytic films). Scanning force microscopy, in contact mode, was used to examine the morphology of the resulting nanometer-sized metal deposits. The metal deposits have been used as nucleation layers for the electroless deposition of conductive, reflective copper films.

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Journal of the Electrochemical Society

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