Kinetics of Low-Pressure Chemical Vapor Deposition of TiO2 from Titanium Tetraisopropoxide
Document Type
Article
Publication Date
1-1-1990
Abstract
We have measured the kinetics of low-pressure chemical vapor deposition of TiO2 from the decomposition of titanium tetraisopropoxide (TTIP) in the absence of a carrier gas. The deposition rate is second-order in TTIP at low pressure and high temperature and converts to zero-order under the reverse conditions. A mechanism is proposed that involves a gas phase bimolecular collision process to produce a reactive intermediate, which subsequently adsorbs and decomposes to produce the TiO2 product. A rate expression for this mechanism is derived and parameter estimates are obtained by fitting to the kinetic results. The parameter values obtained in this manner for the decomposition of the adsorbed intermediate agree well with the results of temperature-programmed decomposition of absorbed TTIP on a Cu surface. © 1990, The Electrochemical Society, Inc. All rights reserved.
Publication Source (Journal or Book title)
Journal of the Electrochemical Society
First Page
814
Last Page
818
Recommended Citation
Siefering, K., & Griffin, G. (1990). Kinetics of Low-Pressure Chemical Vapor Deposition of TiO2 from Titanium Tetraisopropoxide. Journal of the Electrochemical Society, 137 (3), 814-818. https://doi.org/10.1149/1.2086561