Effect of water vs. isopropanol as coreactants for copper chemical vapor deposition
Document Type
Article
Publication Date
12-1-1999
Abstract
A comparison was made between the growth kinetics, morphology and resistivity of copper films using water vs. isopropanol as a co-reactant for the reduction of Cu(hfac)2. The baseline conditions in the absence of a co-reactant resulted in a growth rate of 0.35 mg/sq cm-hr. When water was included as a co-reactant, the growth rate increased incrementally at the rate of 0.042 mg/sq cm-hr per torr water added. The film microstructure and resistivity were substantially improved. In contrast, when isopropanol was added, the incremental rate enhancement was larger by almost an order of magnitude. However, the grain size was much larger and resistivity was generally not as good. The results indicated that water functions to increase the film nucleation rate, with a more modest effect on steady state growth rate. Meanwhile, isopropanol has a limited impact on nucleation but causes a larger growth rate enhancement.
Publication Source (Journal or Book title)
ACS National Meeting Book of Abstracts
Recommended Citation
Griffin, G., Boey, J., & Thiruvenkatachari, R. (1999). Effect of water vs. isopropanol as coreactants for copper chemical vapor deposition. ACS National Meeting Book of Abstracts, PART 1 Retrieved from https://repository.lsu.edu/chem_engineering_pubs/432