Nonaqueous Halide-Free Flux Reactions with Tin-Based Solders

Document Type

Article

Publication Date

4-1-2015

Abstract

New halide-free fluxes are becoming more prevalent in electronic packaging; however, their efficacy and reactive behavior with conventional solders has not been well characterized. In this work, we examine nonaqueous halide-free flux reactions of tin (Sn)-based solder surfaces using electrochemical methods. Cyclic voltammetry was used to study reactions of Sn(II) and Sn(IV) species, x-ray photoelectron spectroscopy (XPS) was used to study surface chemistry, and chronopotentiometry was used to quantify equilibrium constants of Sn–carboxylic complexes. Reactions were investigated using carboxylic acid solutions such as adipic acid or maleic acid in polyethylene glycol. Carboxylic acid-based fluxes are practically inactive toward SnO2 removal at room temperature (25°C); however, some species are capable of removing the oxides at temperatures as high as 180°C and at pH as low as 0.1. XPS results suggest the H+ activity of the carboxylic acid is the key to removing SnO2 on Sn-based solder surfaces. Equilibrium coefficients and potential-pH diagrams are given to elucidate the influence of pH on Sn surfaces.

Publication Source (Journal or Book title)

Journal of Electronic Materials

First Page

1144

Last Page

1150

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